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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

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Michigan Seal Milled into InAs using a Focused Ion Beam

SEM image of a University of Michigan seal milled into an InAs wafer using a low current focused ion beam (FIB) and low ion dose. The outer diameter of the seal is ~ 9.7 µm.
Image by Kevin Grossklaus, Millunchick Research Group.

Ying Qi

John Mansfield

Electronics Engineer (North Campus)

Address:
Electron Microbeam Analysis Laboratory (North Campus)
University of Michigan
418 Space Research Building
Ann Arbor, MI 48109-2143

E-mail: yqi@umich.edu
Phone:(734) 936-3338
Fax: (734) 763-2282

Contact me for:
Nanoindenter training.
General electronics problems in EMAL.

Schedule
My normal schedule 8:30 AM - 12:00 PM on Tuesday, Wednesday and Friday mornings.

How to get training
Use E-mail me or call me to arrange introductions to the EMAL indenter systems (Triboscope and NanoInstruments) or for general electronics problems. My work time is spent split between three buildings, HH Dow, NC EMAL (Space Research Building) and the XMAL facilities in Gerstacker, therefore email is probably the best way to contact me.